China-based Internet of Things (IoT) solutions provider Longsys Technology has created a tiny Silicon-in-package (SiP) Wi-Fi module that will enable high processing power capabilities in size-constrained applications. In other words, it will help enable tiny things connect to the Internet. The LTP0201 module, measuring 6 x 6mm, will be used in IoT sensors and wearables.
The module has integrated MCU, memory, power management and RF parts, and offers device makers a “high performance, low cost, and low power consumption solution for connected products,” the company said. It supports 802.11 b/g/n Wi-Fi standards with integrated TCP/IP protocol stack, and has 1×1 MIMO; its wake up time is a cool 2 ms, and the standby power consumption is less than 1.0mW in low power mode. The module also integrates WEP, TKIP, AES, and WAPI HW secure engines.
“As the fledgling industry evolves, connected devices require more functional chips packaged into one smaller SiP,” said Dave Pang, GM at Longsys. “It can provide a convenient way for developers to add connectivity to their smart products, at a wide range from wearables and home automation, to smart lighting and industrial applications, in a very compact size. It allows faster, simpler development for device manufacturers to produce desirable, functional IoT and wearable products.”
Pang expects SiP modules to become common in IoT devices thanks to their small size, and consistent RF performance.